Scientists have developed a new technique that brings inexpensive computers, cell phones and other systems that substitute flexible plastic for silicon chips one step closer to reality.
Researchers have produced a new two-dimensional material that they believe could revolutionise the electronics market with thinner, faster and lighter gadgets.
Computer maker IBM is developing "skyscraper" computers using huge sandwiches of silicon chips by sticking layer after layer of chips covered with tiny components together.
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